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Analysis Report×テックインサイツジャパン株式会社（TechInsights） - メーカー・企業と製品の一覧

Analysis Reportの製品一覧

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Samsung 3D V-NAND Structure Analysis Report

Samsung 3D V-NAND Structure Analysis Report

This is a structural analysis report of Samsung 3D V-NAND.

This report is a Memory Detailed Structural Analysis (MDSA) of the K9HQGY8S5M 3D V-NAND flash memory. The K9HQGY8S5M is the industry’s first implementation of a 32 cell vertical NAND memory and marks the departure from conventional planar flash memories. 【Features】 ○ Understand key design and manufacturing innovations ○ Make informed technical resource investment decisions ○ Find Evidence of Use For more details, please contact us or download the catalog. *This catalog is in English.

  • Analysis Services

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Waveform Analysis Report of Samsung 21nm TLC NAND

Waveform Analysis Report of Samsung 21nm TLC NAND

To those involved in device design and development! This is an analysis report on Samsung's NAND flash. It explains the important signal operations during device operation!

This is a report on waveform analysis of Samsung's 64 Gbit 21 nm TLC NAND flash from Semiconductor Insights Japan, a leading company in integrated circuit and electronic system technology and patent analysis. This waveform analysis describes the signal behavior of key signals when the device operates in several different standard operating modes. The analyzed component is Samsung's 21nm NAND Flash, where a microprobe was placed on the metal signal line part to operate the device and record the vibration behavior. 【Samsung 21nm NAND Flash】 ○ Used in Samsung's latest solid-state drives 【Observed Signals】 ○ Global word line ○ Bit line ○ P-well isolation ○ Global string select ○ Global ground select, etc. For more details, please download the catalog or contact us.

  • Analysis Services

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Memory Structure Analysis Report "SK Hynix 16 nm"

Memory Structure Analysis Report "SK Hynix 16 nm"

Detailed Memory Structure Analysis Report of Flash Memory

This report is a detailed structural analysis of the SK Hynix H2JTDG8UD1BMS (16 GB, 16nm node MLC NAND flash memory) used in the Apple iPhone 6 Plus smartphone. The device is manufactured using a three-layer metal structure process (1st and 2nd metal layers: W, 3rd metal layer: Al), polysilicon control gates, and polysilicon floating gates. The memory array features a bit line pitch of 32nm and a word line pitch of 38nm. An air gap is employed to reduce crosstalk between adjacent cells. [Features] ○ Understanding of key design and manufacturing innovations ○ Informed technical resource investment decisions based on appropriate information For more details, please contact us or download the catalog.

  • Other analyses

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Report detailing the disassembly analysis of hearing aid products and components.

Report detailing the disassembly analysis of hearing aid products and components.

Currently offering sample reports that provide insights into the design of other companies during the development of medical device products!

TechInsights' teardown services are trusted by client companies in mobile, consumer electronics, medical devices, and other sectors for technology and intellectual property portfolio evaluation and management, acceleration of time-to-market, risk reduction, provision of competitive intelligence, and maximization of ROI. Various manufacturers utilize our teardown services to obtain information such as the following: 【Case Studies for Product Manufacturers】 - Design choices made by competitors - Emerging/leading component suppliers - Key cost factors behind new product features - Competitive advantages of new entrants in international markets 【Case Studies for Semiconductor/Component Suppliers】 - Potential of sockets - Trends in component integration - Trends in packaging - Competitive threats 【Case Studies for Intellectual Property Stakeholders】 - Verification of design wins - Tracking of assertion targets - Market sizing for relevant products and technologies (Custom teardowns are also available to meet unique customer needs.) *For more details, please download the catalog or contact us.

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Report on detailed disassembly analysis of home diagnostic equipment products and components.

Report on detailed disassembly analysis of home diagnostic equipment products and components.

Currently offering sample reports that provide insights into the design of other companies during the development of medical device products!

TechInsights' tear-down services are trusted by client companies in mobile, consumer electronics, medical devices, and other sectors for technology and intellectual property portfolio evaluation and management, acceleration of time-to-market, risk reduction, provision of competitive intelligence, and maximization of ROI. Various manufacturers utilize our tear-down services to obtain information such as the following: 【Use Cases for Product Manufacturers】 - Design choices made by competitors - Emerging/leading component suppliers - Key cost factors behind new product features - Competitive advantages of new entrants in the international market 【Use Cases for Semiconductor/Component Suppliers】 - Potential of sockets - Trends in component integration - Trends in packaging - Competitive threats 【Use Cases for Intellectual Property Stakeholders】 - Verification of design wins - Tracking of assertion targets - Market sizing for relevant products and technologies (Custom tear-downs are also available to meet unique customer needs.) *For more details, please download the catalog or contact us.

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Wearable sensor detailed disassembly analysis report for products and components.

Wearable sensor detailed disassembly analysis report for products and components.

Currently offering sample reports that provide insights into the design of other companies during the development of medical device products!

TechInsights' teardown services are trusted by client companies in mobile, consumer electronics, medical devices, and other sectors for technology and intellectual property portfolio evaluation and management, acceleration of time-to-market, risk reduction, provision of competitive intelligence, and maximization of ROI. Various manufacturers utilize our teardown services to obtain information such as the following: 【Use Cases for Product Manufacturers】 - Design choices made by competitors - Emerging/leading component suppliers - Key cost factors behind new product features - Competitive advantages of new entrants in the international market 【Use Cases for Semiconductor/Component Suppliers】 - Socket potential - Trends in component integration - Trends in packaging - Competitive threats 【Use Cases for Intellectual Property Stakeholders】 - Verification of design wins - Tracking of assertion targets - Market sizing for the relevant products and technologies (Custom teardowns tailored to meet unique customer needs are also available.) *For more details, please download the catalog or contact us.

  • others

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